| Typicality: | 0.467 |
| Saliency: | 0.509 |
| evidently | 4 | manner |
| by solder balls | 4 | other |
| in a wirebonding process | 3 | temporal |
| chip → be mounted on → the substrate | 9 |
| chip → be attached to → substrate | 5 |
| chip → be attached to → the substrate | 4 |
| chip → be assembled to → substrate | 4 |
| chip → be positioned on → substrate | 3 |
| chip → be mounted to → the substrate | 3 |
| chip → be placed on → the substrate | 3 |
| negative | neutral | positive |
| 0.057 | 0.849 | 0.094 |
| Raw frequency | 31 |
| Normalized frequency | 0.509 |
| Modifier score | 0.500 |
| Perplexity | 78.339 |