| receive signal | 0.41 |
| control a buck converter | 0.29 |
| comprise built-in self-… | 0.25 |
| configure to perform th… | 0.25 |
| become available | 0.25 |
| provide a multitude of … | 0.16 |
| intended logic function | 0.29 |
| a bonding pad | 0.29 |
| a differential amplifie… | 0.29 |
| transistor | 0.25 |
| a voltage-mode driver c… | 0.25 |
| a chip ground | 0.25 |
| a nonvolatile memory ce… | 0.25 |
| high integration density | 0.16 |
| defective | 0.29 |
| tested | 0.67 |
| shown in fig | 0.39 |
| described | 0.37 |
| fabricated | 0.36 |
| accomplished | 0.33 |
| arranged | 0.29 |
| accomplished within sho… | 0.26 |
| connected | 0.25 |
| packaged in ceramic fla… | 0.25 |
| tested at first clock s… | 0.25 |
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