Assertion list
die (primary) → ReceivesAction
Results from Ascent++: 150
die → ReceivesAction → cut 0.72
die → ReceivesAction → made 0.70
die → ReceivesAction → rolled 0.68
die → ReceivesAction → cast 0.67
die → ReceivesAction → created 0.58
die → ReceivesAction → tested 0.58
die → ReceivesAction → mounted to the substrate 0.57
die → ReceivesAction → attached to the substrate 0.56
die → ReceivesAction → changed 0.56
die → ReceivesAction → finished 0.56
die → ReceivesAction → thrown 0.56
die → ReceivesAction → shown in fig 0.54
die → ReceivesAction → loaded 0.46
die → ReceivesAction → connected to the substrate 0.46
die → ReceivesAction → prepared 0.45
die → ReceivesAction → adapted 0.44
die → ReceivesAction → linked 0.44
die → ReceivesAction → released 0.44
die → ReceivesAction → closed 0.41
die → ReceivesAction → provided 0.41
die → ReceivesAction → covered 0.41
die → ReceivesAction → reamed 0.41
die → ReceivesAction → set 0.41
die → ReceivesAction → shown 0.41
die → ReceivesAction → used in conjunction 0.40
die → ReceivesAction → pulled 0.40
die → ReceivesAction → replaced 0.40
die → ReceivesAction → affected 0.39
die → ReceivesAction → attached 0.39
die → ReceivesAction → cleaned 0.39
die → ReceivesAction → purchased 0.39
die → ReceivesAction → crafted 0.38
die → ReceivesAction → milled 0.38
die → ReceivesAction → connected 0.38
die → ReceivesAction → developed by fromsoftware 0.38
die → ReceivesAction → placed in a carver press 0.38
die → ReceivesAction → known in the art 0.38
die → ReceivesAction → bonded to substrate 0.37
die → ReceivesAction → coupled to top surface of a sub… 0.37
die → ReceivesAction → attached to first substrate 0.35
die → ReceivesAction → clamped 0.35
die → ReceivesAction → installed 0.35
die → ReceivesAction → modified 0.35
die → ReceivesAction → attached to printed circuit boa… 0.34
die → ReceivesAction → attached to the leadframe 0.34
die → ReceivesAction → customized to the item 0.34
die → ReceivesAction → formed on first substrate 0.34
die → ReceivesAction → formed on the wafer 0.34
die → ReceivesAction → positioned at first bottom dead… 0.34
die → ReceivesAction → rerolled 0.34
die → ReceivesAction → evaluated 0.32
die → ReceivesAction → held in place 0.32
die → ReceivesAction → struck 0.32
die → ReceivesAction → struck by hub 0.32
die → ReceivesAction → used in many ways- 0.32
die → ReceivesAction → used to cut in manufacturing in… 0.32
die → ReceivesAction → added 0.30
die → ReceivesAction → attached to the base 0.30
die → ReceivesAction → brought 0.30
die → ReceivesAction → created in the cutting process 0.30
die → ReceivesAction → designed for use 0.30
die → ReceivesAction → on the brink 0.30
die → ReceivesAction → on the brink of flipping 0.30
die → ReceivesAction → owned by celeste white 0.30
die → ReceivesAction → performed 0.30
die → ReceivesAction → repolished 0.30
die → ReceivesAction → selected 0.30
die → ReceivesAction → tossed with toss 0.30
die → ReceivesAction → used with cutting unit 0.30
die → ReceivesAction → lost 0.28
die → ReceivesAction → altered with small file 0.28
die → ReceivesAction → beveled 0.28
die → ReceivesAction → broken 0.28
die → ReceivesAction → configured to output the read d… 0.28
die → ReceivesAction → connected to fourth electrical … 0.28
die → ReceivesAction → contained within hollow ram 0.28
die → ReceivesAction → downloaded 0.28
die → ReceivesAction → held in position 0.28
die → ReceivesAction → included in the kit 0.28
die → ReceivesAction → inserted 0.28
die → ReceivesAction → lapped 0.28
die → ReceivesAction → made in the usa 0.28
die → ReceivesAction → numbered 0.28
die → ReceivesAction → retooled 0.28
die → ReceivesAction → screwed into the press 0.28
die → ReceivesAction → set in japan’s sengoku era 0.28
die → ReceivesAction → set in white cardstock 0.28
die → ReceivesAction → strobed at precise time 0.28
die → ReceivesAction → trimmed 0.28
die → ReceivesAction → aligned with corresponding mati… 0.25
die → ReceivesAction → annealed 0.25
die → ReceivesAction → arranged to form chamber 0.25
die → ReceivesAction → attached to the carrier 0.25
die → ReceivesAction → attached to the heat spreader 0.25
die → ReceivesAction → attached to the package substra… 0.25
die → ReceivesAction → attached to the support member 0.25
die → ReceivesAction → attached to top surface 0.25
die → ReceivesAction → attributed to benjamin franklin 0.25
die → ReceivesAction → bonded to the base laminate 0.25
die → ReceivesAction → bounded at the orifice 0.25
die → ReceivesAction → brought into play 0.25
die → ReceivesAction → cleaned with kemet cleaning flu… 0.25
die → ReceivesAction → combined 0.25
die → ReceivesAction → connected to each other 0.25
die → ReceivesAction → connected to the pcb 0.25
die → ReceivesAction → controlled 0.25
die → ReceivesAction → delivered 0.25
die → ReceivesAction → determined 0.25
die → ReceivesAction → disassembled 0.25
die → ReceivesAction → disengaged 0.25
die → ReceivesAction → duplicated 0.25
die → ReceivesAction → engraved by halliday 0.25
die → ReceivesAction → fashioned 0.25
die → ReceivesAction → founded by will ferrell 0.25
die → ReceivesAction → heated by radiofrequency energy 0.25
die → ReceivesAction → held by a mint worker 0.25
die → ReceivesAction → installed in the press 0.25
die → ReceivesAction → likely to land 0.25
die → ReceivesAction → mounted in the package 0.25
die → ReceivesAction → mounted on same side 0.25
die → ReceivesAction → moved under pressure 0.25
die → ReceivesAction → owned by original equipment man… 0.25
die → ReceivesAction → placed over the attachment area 0.25
die → ReceivesAction → pre 0.25
die → ReceivesAction → prepared for second impression 0.25
die → ReceivesAction → protected 0.25
die → ReceivesAction → provided with an array of pedes… 0.25
die → ReceivesAction → recessed 0.25
die → ReceivesAction → resurfaced 0.25
die → ReceivesAction → retired 0.25
die → ReceivesAction → run 0.25
die → ReceivesAction → set on the rail 0.25
die → ReceivesAction → set with redding taper 0.25
die → ReceivesAction → set with taper 0.25
die → ReceivesAction → shipped to new orleans 0.25
die → ReceivesAction → shown as wire bonded integrated… 0.25
die → ReceivesAction → stacked in horizontal configura… 0.25
die → ReceivesAction → struck with hammer 0.25
die → ReceivesAction → supported by a driving piston 0.25
die → ReceivesAction → supported on chip mounting area 0.25
die → ReceivesAction → to be solidified in embodiment 0.25
die → ReceivesAction → used to make thread 0.25
die → ReceivesAction → used to remove old sealant 0.25
die → ReceivesAction → easy to use 0.22
die → ReceivesAction → used in die casting 0.22
die → ReceivesAction → read 0.19
die → ReceivesAction → caused by excessive use 0.16
die → ReceivesAction → defaced 0.16
die → ReceivesAction → made in heaven 0.16
die → ReceivesAction → identified 0.09