Ascent++
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lead
aspect of
solder
,
15
assertions
CapableOf
1
pose risk
0.39
HasProperty
4
soft
0.30
flat
0.25
malleable
0.25
long
0.25
ReceivesAction
10
soldered
0.78
bent
0.64
connected by means of a…
0.43
arranged in parallel st…
0.43
arranged in rectangular…
0.39
coupled to the semicond…
0.33
configured
0.33
removed
0.33
shown in figs
0.25
aligned in parallel
0.25