| lead → ReceivesAction → soldered | 0.78 | |
| lead → ReceivesAction → bent | 0.64 | |
| lead → ReceivesAction → arranged in parallel structure | 0.43 | |
| lead → ReceivesAction → connected by means of a solder … | 0.43 | |
| lead → ReceivesAction → arranged in rectangular structu… | 0.39 | |
| lead → ReceivesAction → configured | 0.33 | |
| lead → ReceivesAction → coupled to the semiconductor ch… | 0.33 | |
| lead → ReceivesAction → removed | 0.33 | |
| lead → ReceivesAction → aligned in parallel | 0.25 | |
| lead → ReceivesAction → shown in figs | 0.25 |