excess solder
(subgroup of
solder)
→
ReceivesAction
→
removed
|
0.84 | |
lead
(aspect of
solder)
→
ReceivesAction
→
soldered
|
0.78 | |
| solder → ReceivesAction → melted | 0.76 | |
| solder → ReceivesAction → reflowed | 0.68 | |
| solder → ReceivesAction → removed | 0.68 | |
lead solder
(subgroup of
solder)
→
ReceivesAction
→
used until 1980
|
0.68 | |
melting point
(aspect of
solder)
→
SimilarTo
→
their freezing point
|
0.68 | |
lead
(aspect of
solder)
→
ReceivesAction
→
bent
|
0.64 | |
| solder → IsA → alloy | 0.64 | |
| solder → HasProperty → clean | 0.62 | |
| solder → HasProperty → solid | 0.61 | |
| solder → MadeOf → lead | 0.57 | |
| solder → ReceivesAction → heated | 0.54 | |
| solder → HasA → cadmium | 0.54 | |
| solder → HasA → a melting point | 0.53 | |
| solder → HasProperty → good | 0.53 | |
| solder → ReceivesAction → applied | 0.52 | |
| solder → UsedFor → plumbing | 0.51 | |
| solder → CapableOf → flow into the joint | 0.51 | |
| solder → HasProperty → hot | 0.51 | |
| solder → ReceivesAction → joined | 0.48 | |
| solder → CapableOf → melt at low temperature | 0.46 | |
| solder → HasProperty → free | 0.45 | |
| solder → HasProperty → visible | 0.45 | |
lead
(aspect of
solder)
→
ReceivesAction
→
connected by means of a solder ball
|
0.43 | |
lead
(aspect of
solder)
→
ReceivesAction
→
arranged in parallel structure
|
0.43 | |
| solder → IsA → fusible metal alloy | 0.43 | |
| solder → ReceivesAction → soldered | 0.40 | |
| solder → ReceivesAction → deposited | 0.39 | |
lead
(aspect of
solder)
→
CapableOf
→
pose risk
|
0.39 | |
| solder → HasA → favorable electrical characteristics | 0.39 | |
lead
(aspect of
solder)
→
ReceivesAction
→
arranged in rectangular structure
|
0.39 | |
| solder → ReceivesAction → shown in fig | 0.37 | |
| solder → ReceivesAction → used in electronic | 0.37 | |
| solder → ReceivesAction → intended for use | 0.37 | |
| solder → CapableOf → melt on the tip | 0.37 | |
| solder → HasA → a rosin core | 0.37 | |
| solder → CapableOf → flow into whole braid | 0.37 | |
| solder → IsA → a tin-lead alloy | 0.36 | |
| solder → CapableOf → follow the heat | 0.35 | |
| solder → CapableOf → wick up the wire | 0.35 | |
lead
(aspect of
solder)
→
ReceivesAction
→
coupled to the semiconductor chip
|
0.33 | |
lead
(aspect of
solder)
→
ReceivesAction
→
configured
|
0.33 | |
lead
(aspect of
solder)
→
ReceivesAction
→
removed
|
0.33 | |
| solder → CapableOf → comprise an sn-pb alloy | 0.32 | |
| solder → ReceivesAction → sucked into the joint | 0.32 | |
lead
(aspect of
solder)
→
HasProperty
→
soft
|
0.30 | |
| solder → HasProperty → strong | 0.29 | |
| solder → ReceivesAction → extracted | 0.29 | |
| solder → ReceivesAction → selected | 0.29 | |
| solder → ReceivesAction → drawn up into the wire | 0.29 | |
| solder → ReceivesAction → manufactured as hollow tube | 0.28 | |
| plumber → CapableOf → solder | 0.27 | |
| solder → ReceivesAction → required | 0.25 | |
| solder → CapableOf → connect to peltier thermal cyclers | 0.25 | |
| solder → HasProperty → refrigerated | 0.25 | |
| solder → CapableOf → run out over contiguous metal surfaces | 0.25 | |
| solder → ReceivesAction → disposed in the space | 0.25 | |
| solder → HasProperty → soft | 0.25 | |
| solder → CapableOf → solidify the smt components | 0.25 | |
| solder → CapableOf → affix the smt components | 0.25 | |
| solder → CapableOf → flow onto the wire | 0.25 | |
| solder → CapableOf → flow onto the pad | 0.25 | |
| solder → CapableOf → bond to material | 0.25 | |
| solder → CapableOf → come in a variety of hardnesses | 0.25 | |
| solder → ReceivesAction → known in the art | 0.25 | |
| solder → ReceivesAction → intended to melt at 450° c | 0.25 | |
| solder → CapableOf → flow into the gap | 0.25 | |
| solder → ReceivesAction → reheated | 0.25 | |
| solder → CapableOf → bond to workpiece | 0.25 | |
| solder → CapableOf → melt on contact | 0.25 | |
| solder → CapableOf → flow over the tip | 0.25 | |
| solder → CapableOf → coat the metal | 0.25 | |
| solder → ReceivesAction → supplied in the kit | 0.25 | |
| solder → HasProperty → compatible | 0.25 | |
| solder → CapableOf → flow to bottom surface | 0.25 | |
lead
(aspect of
solder)
→
HasProperty
→
flat
|
0.25 | |
lead
(aspect of
solder)
→
ReceivesAction
→
shown in figs
|
0.25 | |
lead
(aspect of
solder)
→
HasProperty
→
malleable
|
0.25 | |
lead
(aspect of
solder)
→
HasProperty
→
long
|
0.25 | |
lead
(aspect of
solder)
→
ReceivesAction
→
aligned in parallel
|
0.25 | |
| solder → Causes → short circuits | 0.23 | |
| solder → ReceivesAction → used in process | 0.21 | |
| solder → UsedFor → the best possible signal transfer | 0.20 | |
| solder → CapableOf → lie at different heights | 0.16 | |
| solder → CapableOf → cool in place | 0.16 | |
| solder → CapableOf → cool in just a few milliseconds | 0.16 | |
| solder → CapableOf → stick to the tip | 0.09 | |
| solder → UsedFor → repair | 0.09 |